Product Main

Specifications

 
Key Specifications/Special Features:
  • Base material: FR4 TG150
  • Board thickness: 2.0mm
  • Layers: 2
  • Minimum line width/spacing: 0.3mm/0.1mm
  • Minimum drilling hole: 0.3mm
  • Finish copper thickness: 1oz
  • Surface finish: lad-free HASL
  • Specialty: carbon ink printing
  • Applications: automotive electronics
  • Craft ability table:
    • Minimum line width/spacing: 0.075mm/0.075mm
    • Minimum solder mask dam: 0.075mm
    • Minimum and maximum board thickness: 0.1-3.2mm
    • Maximum finish copper thickness: 10oz
    • Maximum board size: 546 x 1200mm
    • Maximum layer count: 22
    • Contact resistance: ≤200Ω