Key Specifications/Special Features: Base material: FR4 Board thickness: 1.6mm Layer: 4 Minimum line width/spacing: 0.1mm/ 0.1mm Minimum hole diameter: 0.2mm Finish copper thickness: 1oz Surface finish: ENIG and gold finger Craft ability table: Minimum line width/spacing: 0.075mm/0.075mm Minimum solder mask dam: 0.075mm Minimum and maximum board thickness: 0.3 to 3.2mm Maximum finish copper thickness: 10oz Maximum board size: 546 x 622mm Maximum layers count: 22 Impedance control: ±8%