• Specifications:
  • Base material: FR4 TG140
  • Board thickness: 1.6mm
  • Layer: 6
  • Minimum line width/spacing: 0.1mm/0.08mm
  • Minimum drilling hole: 0.3mm
  • BGA: 0.05mm
  • Finish copper thickness: 1oz
  • Surface finish: ENIG + gold finger
• Craft ability table:
  • Minimum line width/spacing: 0.075mm/0.075mm
  • Minimum solder mask dam: 0.075mm
  • Minimum and maximum board thickness: 0.3 to 3.2mm
  • Maximum finish copper thickness: 10oz
  • Maximum board size: 546 x 622mm
  • Maximum layers count: 22
  • Impedance control: ±8%