• Specifications:
  • Board thickness: 1.6 mm
  • Layer: single
  • Minimum line width/spacing: 0.35mm/0.45mm
  • Minimum drilling hole: 0.3
  • Finish copper thickness: 1oz
  • Surface finish: OSP
  • Applications: LED and Optoelectronics products
  • Specialty: 2 solder mask sides
• Craft ability table:
  • Minimum line width/spacing: 0.075mm/0.075mm
  • Minimum solder mask dam: 0.075mm
  • Minimum and maximum board thickness: 0.1 to 3.2mm
  • Maximum finish copper thickness: 10oz
  • Maximum board size: 546 x 1200mm
  • Maximum layers count: 22
  • Impedance control: ±8%