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Specifications

High precisn Double side Fine Grinding & Lapping machine

DSG series are suitable for all kinds of materials from metal industries, glass, ceramics and plastics to semi-conductor industries. This series can be applied into nearly all materials with ever growing of machining technology. It fulfills customers’ requirements in respect of surface quality, parallelism, flatness, and thickness variation.
 
Features:
-Reliability- digital size controller
-Accuracy-rigid body ensures no vibration
-Simple & user friendly operation- soft touch screen
- Real 4 way system which has upper and lower wheel drive, sun gear are driven by independent geared motor with AC inverter.
-Vibration damped cast iron frame maintains accuracy
-Various application for fine Grinding, Lapping and Polishing
-Pre, main and post load position can be controlled by simple setting
-Operator get more space for loading and unloading from upper wheel Swivel device
 
Model
DSG-400/500
DSG-600/700
DSG-800
DSG-1000/1200
Wheel Diameter
[mm]
Φ401/475
Φ632/700
Φ840
Φ1000/1200
Ring width Maximum
Workpiece size[mm] (optional)
Φ117
Φ205
Φ300
Φ350
Max. load pressure(DaN)
300
600
900
1000/1500
Upper Wheel
Drive (kW)
1.1
3.0/5.5
7.5/15
15/20
RPM(min-1)
70
75/125
76/110
110/150
Lower Wheel
Drive (kW)
1.1
3.0/5.5
7.5/15
15/20
RPM(min-1)
70
75/125
75/110
110/150
Inner Gear
Drive (kW)
0.37
1.5/2.0
3.0/5.5
5.5/7.5
RPM(min-1)
40
50/75
75/87
45/75
Dimension(W*D*H)[mm]
1350*1100*2000
1700*1500*2290
2100*1750*2900
2560*2935*2242
Weight
1500 kg
2800 kg
4500 kg
6000 kg
Specifications can be modified
 
 
Applications:
Tungsten Carbide, Sinter Metal, Hard Metal, Bronze, Aluminum, Quartz, Crystal, Sapphire, Optical Glass, MLCC, Ceramic Substrate, Zirconium,  Engineering Plastics, Composite, NTC Substrate, PZT Substrate, Diamond dicing Blade, Ferrite, Silicon, Silicon Carbide, etc