Layer: 2-28 layer

Max process size: 700mm*1100mm

Copper thickness: 0.5oz--13oz

Min line width/space: 3mil/3mil

Finished min hole diameter: 0.15mm

Aspect ratio: 12: 1

Impedance control: +/-10%

Surface finish: HASL/HASL lead free, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating

Solder mask color: Green/yellow/black/white/red/blue

Profiling: Punching, Routing, V-CUT, Beveling

base material: FR-4(S1130/S1141/S1170), Tg130℃/Tg170℃, Rogers, Berquist, thermagon,(taconic)

Packing: Vacuum Packing

Standard:  RoHS, SGS, UKAS, ISO14001, DNV,UL

The capacity of double-sided board: 60000m²/year

The capacity of multilayer board: 100000m²/year

 

We have:

Advanced equipment

Reliable quality

Reasonable price

High output

Quick delivery