Multilayer PCBs
Major material: FR-4, Nelco, HTG>170, High CTI value, halogen free
Minimum board thickness:
Double sided: 0.2mm
Multilayer: 0.4mm
Maximum board thickness:
Double sided: 2.4mm
Multilayer: 3.2mm
Surface finishing:
HAL
Lead-free HAL
Flash gold
Selective Gold
Immersion gold (ENIG)
Immersion tin
Immersion silver
Carbon print
Gold fingers
Entek (OSP)
Flux coating
Peelable mask
Gold Plating (hard gold)
ENIG thick Gold
Solder mask plugged hole
Copper finished thickness:
1/2 oz to 6 oz
Minimum hole size: 0.25mm
Minimum line width/spacing: 0.1
Major material: FR-4, Nelco, HTG>170, High CTI value, halogen free
Minimum board thickness:
Double sided: 0.2mm
Multilayer: 0.4mm
Maximum board thickness:
Double sided: 2.4mm
Multilayer: 3.2mm
Surface finishing:
HAL
Lead-free HAL
Flash gold
Selective Gold
Immersion gold (ENIG)
Immersion tin
Immersion silver
Carbon print
Gold fingers
Entek (OSP)
Flux coating
Peelable mask
Gold Plating (hard gold)
ENIG thick Gold
Solder mask plugged hole
Copper finished thickness:
1/2 oz to 6 oz
Minimum hole size: 0.25mm
Minimum line width/spacing: 0.1
Standard: RoHS, SGS, UKAS, ISO14001, DNV,UL
We have:
Advanced equipment
Reliable quality
Reasonable price
High output
Quick delivery
Unlimited ordering quantity