Metal bond diamond cutting disc
1. Widely used for cutting monocrystalline silicon, polysilicon, semiconductor materials, stone graphite, ceramics, glass, and other hard materials.
2. Different specifications can be made according to customers' different requirements.
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Diameter mm
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Hole mm
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Thickness mm
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Tolerance mm
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Φ25~60
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Φ6~10
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0.2
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0.0025
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Φ25~60
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Φ6~10
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0.3~0.6
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0.005
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Φ70~150
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Φ6~114.3
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0.4~1.0
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0.005
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Φ125~200
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Φ20~32
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1.2~1.8
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Φ250~300
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Φ25~50
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1.8~2.5
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Φ350~450
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ΦΦ25~50
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2.0~2.8
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