Electroplated diamond tools for Photovoltaic Industry
Diamond cutting disc:
Widely used for cutting polysilicon, monocrystalline silicon, semiconductor materials, stone graphite, ceramics, glass and other hard materials.
Different specifications can be made according to customers' different requirements.
Widely used for cutting polysilicon, monocrystalline silicon, semiconductor materials, stone graphite, ceramics, glass and other hard materials.
Different specifications can be made according to customers' different requirements.
|
Diameter mm
|
Hole mm
|
Thickness mm
|
Tolerance mm
|
|
Φ100
|
Φ5~20
|
0.6~2
|
400/500~800/1000
|
|
Φ200
|
Φ10~50
|
1.2~3
|
400/500~800/1000
|
|
Φ300
|
Φ20~50
|
2.0~4
|
400/500~800/1000
|
|
Φ400
|
Φ20~100
|
2.8~5
|
400/500~800/1000
|
|
Φ500
|
Φ20~100
|
3.5~6
|
400/500~800/1000
|
|
Φ600
|
Φ20~100
|
3.5~6
|
400/500~800/1000
|
|
Φ700
|
Φ20~100
|
4.0~6
|
400/500~800/1000
|
|
Φ800
|
Φ20~100
|
4.0~6
|
400/500~800/1000
|
|
Φ900
|
Φ20~100
|
4.0~6
|
400/500~800/1000
|
Diamond inside cutting discs:
1. Widely used for cutting silicon, semiconductor materials, magnetic materials, crystal, germanium, and non-metallic materials. Existing products include inside edge cutting disc of Φ596, Φ380, Φ271, Φ246, Φ206 and other products.
2. Different specifications can be made according to customers' different requirements.
|
DIAMETER mm
|
HOLE mm
|
THICKNESS mm
|
|
Φ206
|
Φ40
|
0.09~0.1
|
|
Φ246
|
Φ60
|
0.09~0.1
|
|
Φ271
|
Φ80
|
0.09~0.1
|
|
Φ380
|
Φ130
|
0.09~0.1
|
|
Φ420
|
Φ152
|
0.09~0.1
|
|
Φ596
|
Φ203
|
0.09~0.1
|