Hot bar bonding machine:
1,pulse rotary double-position operation,great improve the efficiency.
2,apply to soft to hard TAB,TCP,ACAand FPC,FFC,PCB etc.
Hot bar bonding machine technology parameters :
Model: CWPC-1A
Max. Working Area: 200mm X 260mm
Fixture: 2 sets
working air pressure: 0.45-0.7Mpa
Temperature setting: 20-500℃
Temperature precision: ±2℃
Hot bar bonding time: 1-99 s
force head pressure: 0.1-0.6 MPa
Hot bar bonding temperature method:Pulse Heat
voltage and processing power :110V/220V 2000W(moment)
Size: 620mm X 690mm X 570mm
Weight: 95Kg
Model: CWPC-1A
Max. Working Area: 200mm X 260mm
Fixture: 2 sets
working air pressure: 0.45-0.7Mpa
Temperature setting: 20-500℃
Temperature precision: ±2℃
Hot bar bonding time: 1-99 s
force head pressure: 0.1-0.6 MPa
Hot bar bonding temperature method:Pulse Heat
voltage and processing power :110V/220V 2000W(moment)
Size: 620mm X 690mm X 570mm
Weight: 95Kg
Hot bar bonding machine features:
1.Extremely short cycle time with rotary table design. Product loading and unloading can be
1.Extremely short cycle time with rotary table design. Product loading and unloading can be
done during the heat sealing process
2.High quality heat seal application up to 0.25mm pitch
3.Pneumatic bonding head provide up to 3,900N force
4.Digital programmable pressure control with LCD display
5.Closed loop PID temperature control with visible LED display
6.Bonding cycle is triggered by a real time pressure sensor
7.Floating Thermode ensure consistent pressure and heat transfer along the flexfoil to LCD
2.High quality heat seal application up to 0.25mm pitch
3.Pneumatic bonding head provide up to 3,900N force
4.Digital programmable pressure control with LCD display
5.Closed loop PID temperature control with visible LED display
6.Bonding cycle is triggered by a real time pressure sensor
7.Floating Thermode ensure consistent pressure and heat transfer along the flexfoil to LCD
and/or PCB
8.Precision product fixtures (2X), easy exchange, provided with micrometer alignment and
8.Precision product fixtures (2X), easy exchange, provided with micrometer alignment and
vacuum to fix components
9.Optional CCD alignment module with frame, camera, lens, monitor and illumination for fine
9.Optional CCD alignment module with frame, camera, lens, monitor and illumination for fine
pitch application
10.Full microprocessor logic control
10.Full microprocessor logic control