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Quick Details

Place of Origin:
Brand Name:
Model Number:
Base Material:
Copper Thickness:
Board Thickness:
Min. Hole Size:
Min. Line Width:
Min. Line Spacing:
Surface Finishing:
Board thickness: 1.7mm
Copper thickness: 2oz
Surface finished: HASL Lead free
soldermask: Black
Silkscreen: /

Specifications

Specifications of 3.5mm Jack PCB:

UL(E320003) approved pcb with assembly service
0. High quality pcb board !
0. We have UL certification !
0. Paking is as requirements !
0. There is a professional team to follow PCB fabrication process, PCB quality and lead time are guaranteed.
 
PCB Capability:
Item Mass Production Pilot Run Production
Capacity Capacity
Layer Counts 1L— 18L, HDI 20-28 , HDI
Material CME1, CME3, FR-4, High TG FR4 , Halogen-free FR4 , aluminium , Ceramic
Teflon, PTFE(F4B, F4BK), Rogers(4003,4350,5880) Taconic(TLX-8, TLX-9), Arlon(35N, 85N)etc.
Material Mixed Laminate 4 layers -- 10 layers 12 layers
FR4+Ro4350 , FR4+Aluminium
Maximum Size 610mm X 1200mm 1200 - 2000MM
Board Outline Tolerance ± 0.15mm ± 0.10mm
Board Thickness 0.4mm--6.00mm 0.1mm--8.00mm
Thickness Tolerance ( t≥ 0.8mm) ± 8% ± 5%
Thickness Tolerance( t< 0.8mm) ± 10% ± 8%
Minimum Line / Space 0.10mm 0.075mm
Trace width Tolerance 15%-20% 10%
Minimum Drilling Hole (Mechanical) 0.2mm 0.15mm
Minimum laser hole 0.1mm 0.075mm
Hole Position/hole Tolerance ± 0.05mm PTH: ± 0.076MM NPTH: ± 0.05mm
Mini hole ring (single 0.075MM 0.05MM
OutLayer Copper Thickness 17um--175um 175um--210um
InnerLayer Copper Thickness 17um--175um 175um--210um
Mini Solder Mask Bridge 0.05mm 0.025mm
Impedance Control Tolerance ± 10% ± 5%
Surface Finishing HASL, Lead free HASL, Immersion gold, Immersion tin, Immersion Silver.
Plated gold , OSP, Carbon ink,
1-2L Lead-time 3-7 days 1-2 days
4- 8L Lead-time 7-10 days 2-7 days
10-18L Lead-time 10-15 days 4-9 days
20-28L Lead-time 15-20 days
Acceptable File Format ALL Gerber Files, POWERPCB, PROTEL, PADS2000, CAD, AUTOCAD, ORCAD, P-CAD, CAM-350, CAM2000 etc.