Polycrystalline Diamond Powder or Slurry
Characteristics:
It’s structure similar to natural carbonado diamond..
Microcrystalline with basic grain size less than 100 nm to compose diamond particles through a common crystal surface.
In processing high hardness special materials, the removal rate of poly diamond is common diamond 2~ 4 times but no scratches.
Rounded particle shape, no irregular shape like strip and flakes.
Completely remove oversize particles..
Narrow PSD
Surface purity reaches PPM grade.
Good dispersion property.
Applications:
Grinding and polishing of semiconductor wafers, such as SiC, sapphire wafer etc.
Polishing of the surface of various ceramic materials..
Polishing the surface of metal materials, such as stainless steel, aluminum alloy etc.