Resin Infusion 5168B/H

Li-bond 5168B/H epoxy system is curing at room temperature 25℃, after appropriate hardening(at least 60℃) will have excellent mechanical and physical property. Qualified by GL certificate.

The advantages:

1.  Lowest mixture viscosity

2.  Low temperature for exothermic (approx. 40℃)

3.  Excellent fiber wet ability

4.  Curing at room temperature, do not need extra pressure when curing.

5.  Low shrinkage, after forming the internal stress is low.

6.  Usage time is longer.

 

Structural Resin 5166B/H

Li-bond 5166 B/H is two-component structural resin. It is consisted of epoxy base resin and hardener which is solvent-free and has good thixotropy. As at the suggested working temperature, it won't be sagged even used in vertical surface/chink or crevice. It is suitable for pre-preg to pre-preg, FRP to FRP, metal to inorganic. For example: the bonding of upper and lower casing of wind blades.

1.  Two-component structural resin.

2.  Good thixotropy after mixed.

3.  Has good adhesion for glass/fiber composite.

4.  Longer usage time.

5.  Excellent mechanical and physical property after appropriate hardening. (approx. 80℃)

6.  Modified epoxy resin system, good toughness.