| Place of Origin: | China (Mainland) |
|---|---|
| Brand Name: | chenonn |
| Model Number: | chenonn201311113 |
| Base Material: | fr4 |
| Copper Thickness: | 1OZ |
| Board Thickness: | 1.6mm |
| Min. Hole Size: | 0.2 |
| Min. Line Width: | 3mil |
| Min. Line Spacing: | 3mil |
| Surface Finishing: | HASL |
Quick Details
Specifications
Specifications1. PCB layout, PCB design;
2: Make high difficulty PCB (1 to 28 layers)
3: Provide all Electronic components;
4: PCB assembly; LEACH, also offers: - Contract Manufacturing- Engineering Services- PCB Design & Assembly- Product Design- Prototyping- Cable and Wire Assemblies- Plastics and Molds 1.Detailed Specification of PCB Manufacturing
2.Detailed Terms for Pcb AssemblyTechnical requirement: 1) Professional Surface-mounting and
Through-hole soldering Technology2) Various sizes like precision0402, 0603,
0805, 1210 and 2512 components SMT technology3) ICT(In Circuit Test),FCT(Functional
Circuit Test) technology.4) PCB Assembly With CE,FCC,Rohs Approval5) Nitrogen gas reflow soldering technology
for SMT.6) High Standard SMT & Solder Assembly
Line7) High density interconnected board
placement technology capacity. Quote requirement: 1)Gerber files of the bare PC board
2)BOM file (Components List): manufacturer's part number, type of part, packaging type, component locations and quantity
3)Dimensional specification for non-standard components
4)Assembly drawing
5)Final test procedures (if applicable)
6)in order to shorten the lead time, please advise us alternative parts (same specifications but different brand name)
7)Estimated order quantity
8)If possible, please send prototype/sample board/photo to us for further reference
2: Make high difficulty PCB (1 to 28 layers)
3: Provide all Electronic components;
4: PCB assembly; LEACH, also offers: - Contract Manufacturing- Engineering Services- PCB Design & Assembly- Product Design- Prototyping- Cable and Wire Assemblies- Plastics and Molds 1.Detailed Specification of PCB Manufacturing
| 1 | Layer | 1-8 layer |
| 2 | Material | FR-4,CEM-1,CEM-3,Hight TG,FR4 Halogen Free,FR-1,FR-2,Aluminum |
| 3 | Board thickness | 0.2mm-7mm |
| 4 | Max.finished board side | 500mm*500mm |
| 5 | Min.drilled hole size | 0.25mm |
| 6 | Min.line width | 0.075mm(3mil) |
| 7 | Min.line spaceing | 0.075mm(3mil) |
| 8 | Surface finish/treatment | HALS/HALS lead free, Chemical tin, Chemical Gold, Immersion gold, Inmersion Silver/Gold, Osp, Gold Plating |
| 9 | Copper thickness | 0.5-4.0oz |
| 10 | Solder mask color | Green /black/white/red/blue/yellow |
| 11 | Inner packing | Vacuum packing, Plastic bag |
| 12 | Outer packing | Standard carton packing |
| 13 | Hole tolerance | PTH:+_0.076,NTPH:+_0.05 |
| 14 | Certificate | ,ISO9001, ROHS, Fcc |
| 15 | Profiling Punching | Routing, V-CUT, Beveling |
| 16 | Assembly Service | Providing OEM service to all sorts of printed circuit board assembly |
2)BOM file (Components List): manufacturer's part number, type of part, packaging type, component locations and quantity
3)Dimensional specification for non-standard components
4)Assembly drawing
5)Final test procedures (if applicable)
6)in order to shorten the lead time, please advise us alternative parts (same specifications but different brand name)
7)Estimated order quantity
8)If possible, please send prototype/sample board/photo to us for further reference

