Cp3 is a high precision automatic solder paste printer, which is designed for high precision steel mesh or stencil printing in SMT industry.
Product Features:
Wide compatibility for PCB dimensions from 50mm x 50mm to 400mm x 340mm and PCB thickness from 0.6mm to 6mm.
High printing resolution:
High positional accuracy, repeated positioning accuracy ±0.01mm; printing accuracy 0.025mm
Support glue printing
Automatic control improves production efficiency, quality control and saves production cost:
Automatic PCB alignment
Squeegee pressure adjustable
Automatic printing
Automatic stencil cleaning (dry-type and wet-type)
Adopt company independently developed suspended print head and manual air pressure adjustment system to balance squeegee pressure to ensure perfect forming effect of solder paste.
Multi-functional PCB fixed positioning system, convenient and accurate PCB positioning.
Programmable PCB lifting platform to lift the PCB to a proper height
Upward and downward visual positioning.
Built-in image processing system
Applicable Component Types
SMT Components such as resistors, capacitors, inductors, diode and triode: 01005, 0201, 0402, 0603, 0805, 1206 and other specifications
IC: support SOP, TSOP, TSSOP, QFN packaging, min. pitch 0.3 mm; support BGA, CSP packaging, min. ball diameter of 0.2 mm
Printing size: 50mm x 50mm ~400 mm x 340 mm
PCB Thickness: 0.6 mm ~ 6 mm
FPC Thickness: 0.6 mm ~ 6 mm (excluding jig) 
PCB Application
Applicable to production and manufacturing of mobile phone, communication, LCD TV, STB, family cinema, vehicle electronics, medical power equipment, aerospace and aviation, besides general electronics products.
Specification
* The following data is obtained under ambient temperature of 25 ℃ and humidity of 60%
            Items 　 　　               Parameter
Repeat Position Accuracy ±0.01mm(test data and method can be provided)
Printing Accuracy 　±0.025mm(test data and method can be provided)
Cycle Time 　<9s (Excluding Printing & Cleaning)
Products Changeover 　<5Min
Screen Stencil Size/Min 　470mm X 370mm
Screen Stencil Size/Max 　737mm X 737mm
Screen Stencil Size/Thickness 　20mm ~ 40mm
PCB Size/Min 　50X50mm
PCB Size/Max 　400X340mm
PCB Thickness 　0.6~6mm
PCB Warpage Ratio 　＜1%(Based on diagonal length)
Bottom of Board Size 　10mm
Edge of Board Size 　3mm
Transport Height 　900±40mm
Transport Direction 　Left-Right; Right-Left; Left-Left; Right-Right
Transport Speed 　100-1500mm/sec Programmable
Board Location Support System Magnetic pin/Side support block/Flexible automatic pin(optional)
 Clamping System Elastic side clamping/ Elastic Z-direction tabletting (optional, but not suggested)
Print head 　Pneumatic control print head
Squeegee Speed  　10~150mm/sec
Squeegee Pressure 　0~0.5MPa with adjustable pressure reducing meter valve
Squeegee Angle 　60°(Standard)/55°/45°
Squeegee Type 　Steel squeegee (standard), rubber squeegee, other types of squeegee customizable.
Stencil Separation Speed 　0.01~10mm/sec Programmable
Cleaning Method 　Dry-type, wet-type ( Programmable combination of Cleaning methods)
Table Adjustment Range 　X: ±4mm;Y:±6mm;θ:±2°
Type of Image Fiducial Mark 　Standard geometry shape of fiducial mark, bonding pad / stencil hole
Camera System 　Single digital camera with upward/downward vision system
Air Pressure 　4~6Kg/cm2
Air Consumption 　Approx. 0.07m3 /min
Control Method 　PC Control
Power Supply 　AC:220±10%,50/60HZ 1Φ 1.5KW
Machine Dimensions 　1220mm(L) x 1410mm(W) x 1550(H)mm (excluding the height of indicating lighthouse)
Weight 　Approx:1000Kg
Operation Temperature 　-20°C ~ +45°C
Operation Humidity 　30%~60%