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Base Material:
Copper Thickness:
Board Thickness:
Min. Hole Size:
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Surface Finishing:

Specifications

Layer: 12 HDI  2+8+2
Material: FR4 Tg170
laser: 1-2L, 2-3L, 10-11L, 11-12L, 0.1mm
Thickness board: 1.8mm, ±10%
Outer finish copper: 35um
Inner copper: 35um
Minimum L/W: 0.15/0.15mm
Minimum holes: 0.2mm
Hole copper thickness: 25um
Surface finish: ENIG
100% E-test