Product Main

Quick Details

CAS No.:
Other Names: LED encapsulant sealant
MF:
EINECS No.:
Place of Origin: China (Mainland)
Classification: Double Components Adhesives
Main Raw Material: Silicone
Usage: Packing
Brand Name: Betely
Model Number: BQ-4370

Specifications

Explanation
This product is a low refractive index component liquid silicone potting, sealing is mainly used for electronic components, and strengthen the integrity of electronic devices to improve the external shock and vibration resistance. Improved internal components, insulation between the lines, allowing the device to a small, lightweight, to avoid components, lines directly exposed to the environment, to improve the waterproof performance of the device. This product has a high transmittance, good weather resistance, heat resistance, good fluidity, high bonding strength with the advantages of PPA.

Applications
LED SMD package
Use
1 Use the proportion: BQ-4370-1A: 1
BQ-4370-1B: 1;
(2) The A, B material was mixed to no knots, no lumps, a uniform thin thick homogeneous state (generally requires 5-8 minutes), placed under vacuum deaeration, until no bubbles up (pumping
Vacuum degassing process without heating), mixed good glue as possible within 8 hours.
3. Degassing is completed, the plastic material poured into the filling plastic syringes. To further drive out the air rubber, plastic material can be installed on the vacuum syringe bubble row again.
4 Glue, should first stand or pedestal preheated 150 ℃ / 1H above, to remove moisture inside the stand or base, in order to avoid air bubbles during curing.
5 curing conditions :80-100 ℃ / 1H +150 ℃ / 3H long roast
Note: You can adjust according to actual situation, but you must be thorough test compound packaging specifications A, B: 0.5Kg / bottle
Storage conditions Store in a cool dry and ventilated enclosed place (storage temperature -5 ~ 25 ℃, humidity ≤ 65%), waterproof, leak-proof, sunscreen, anti-high temperature, away from sources of ignition.
Shelf life 6 months
Precautions
Applications: 1.BQ-4370-1A / B using stored process must ensure that no phosphorus (P), sulfur (S), nitrogen (N), the organic tin (Sn), water, polyurethane resin, catalyst poisons, in order to avoid
Obstruction and deterioration caused by curing (eg: cleaning plastic cup of the solution, oven residual toxic ingredients, organic acids, etc.).
(2) If it is found at the bottom of a precipitate B agent turbidity, is a normal phenomenon, shake well before using.
Security: 1. Products should pay attention to protective wear, avoiding the construction process heat burns, prohibit the consumption.
(2) Be careful using this, Before and during use, please pay attention to safety issues. Furthermore, it should follow the relevant national or local government safety regulations. (Detailed safety instructions refer to the corresponding MSDS)
Disclaimer: This product catalog provides information entirely based on laboratory testing and practical experience gained understanding, we strive to accurately and believe that a high reference value. However, as the product is often used in conditions beyond our control, we can only guarantee the quality of the product itself. We reserve the right to modify without notice the specification right.
Previous product:SMD