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Quick Details
Specifications
4-layer rigid-flex
Major materials: polyamide flexi and FR-4
Board thickness: 0.2 to 3.2mm
Surface finish: HASL, OSP (Entek), immersion gold/silver/tin, peelable mask
Solder mask: wet film
Copper thickness: 0.5 to 4oz
Minimum hole size: 0.2mm
Minimum line width and spacing: 3/3mil
Out line: v-cut, routing and punch
Major materials: polyamide flexi and FR-4
Board thickness: 0.2 to 3.2mm
Surface finish: HASL, OSP (Entek), immersion gold/silver/tin, peelable mask
Solder mask: wet film
Copper thickness: 0.5 to 4oz
Minimum hole size: 0.2mm
Minimum line width and spacing: 3/3mil
Out line: v-cut, routing and punch