| Place of Origin: | China (Mainland) |
|---|---|
| Brand Name: | OEM |
| Model Number: | K001 |
| packing: | ESD |
Quick Details
Specifications
Specifications
PCB Capability
Conductor width/spacing | 4 mils |
Aspect Ratio | 1 : 16 |
Min Finish hole diameter | 0.10mm |
Multi-layers | Up to 16 layers |
Board thickness | Minimum 0.25mm, Maximum 3.8mm |
Solder Mask | LPI, Peelable ink, Carbon ink |
Legend | Two Part epoxy and UV |
Surface Finishes | HASL, Flash Gold, Immersion Silver, Immersion Tin, Immersion Ni/Au, OSP, Selective Hard Gold. |
Electrical Test | Voltage : 10-250V |
Profiling | Punching, Routing, V-Cut |
Gold finger thickness | 1-1.2 μm (Au) |
Maximum panel size | 610 mm X 508 mm (24" X 20" ) |
Impedance Control | +/- 10% |
PCB Assemblies Services
Surface Mount Technology (SMT)
Through Hole Circuit Boards (PTH)
Mixed Technology PCB
Functional Testing
Box Build; Full Assemblies
Through Hole Circuit Boards (PTH)
Mixed Technology PCB
Functional Testing
Box Build; Full Assemblies
BGAs and CCGAs
Micro and Fine Pitch BGAs
SMT 24" x 30"for press fit Backplanes
CGA's to 1.0mm PBGA's,
uBGA's CSP,s to 0.5mm
leaded parts to 0.3 mm
chips and discretes to 0402
Automatic wave solder 18" max board width *__ length
Selective soldering capabilities - no board size limitation
Micro and Fine Pitch BGAs
SMT 24" x 30"for press fit Backplanes
CGA's to 1.0mm PBGA's,
uBGA's CSP,s to 0.5mm
leaded parts to 0.3 mm
chips and discretes to 0402
Automatic wave solder 18" max board width *__ length
Selective soldering capabilities - no board size limitation