| Place of Origin: | China (Mainland) |
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Quick Details
Specifications
Silicon wafer is the most common material and widely used for a varity of high-tech industries, including integrated circuits, detector or sensor device, MEMS fabrication, opto-electronic components, and solar cells.
Grow method: CZ or FZ
Diameter: 2 to 12 inch
Finish: As cut, lapped, etched, SSP, DSP
Orientation: (100) (111) (110)
Type: N or P
Resistivity: CZ: From 0.0005 to 150 Ωcm
FZ: Up to 10 kΩcm
Grow method: CZ or FZ
Diameter: 2 to 12 inch
Finish: As cut, lapped, etched, SSP, DSP
Orientation: (100) (111) (110)
Type: N or P
Resistivity: CZ: From 0.0005 to 150 Ωcm
FZ: Up to 10 kΩcm

