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Place of Origin: China (Mainland)
Brand Name: CHINAFIX
Model Number: CF160
Voltage: AC 220V/50-60HZ
Current:
Rated Capacity:
Rated Duty Cycle:
Dimensions: Lmm360*Wmm520*H430mm
Weight: 15KG
Usage: welding bga chips
Certification: CE ROHS
After-sales Service Provided: Engineers available to service machinery overseas
Power supply: AC 220V/50-60HZ
Heating Method: Two-side infrared heating
PCB size: 405mm*310mm
Maximum Power: 2.3KW
Suitable chip size: less than 50mm

Specifications

Functional Parameter

 

Basic Standard

Power supply

AC 220V/50-60HZ

Heating Method

Two-side infrared heating

Demension

Lmm360*Wmm520*H430mm

Maximum Power

2.3KW

PCB size

405mm*310mm

Temperature Control Method

Heating controlled independently

Yes

Upper heating control method

High-precision closed-loop control, instrument error is about 0.5%

Upper temperature control and measuring method

High sensitivity temperature sensor, temperature monitoring indirectly.(monitor temperature of heater element)

Bottom heating control method

High-precision closed-loop control, instrument error is about 0.5%

Bottom temperature control and measuring method

High sensitivity temperature sensor, temperature monitoring indirectly. (monitor temperature of heater element)

Rework station Function

Application type

Be suitable for welding,sealing-off or repairing BGA,PBGA,CSP on different PCB and more kinds of encapsulation mode component, all suitable for lead or lead-free soldering.

Suitable chip size

less than 50mm

Other Performances

Standby Protection

Yes

Auxiliary lighting

Yes



Features:

 

 

In the continuous exploration and practice, we make clear our R&D policy gradually, and we think that BGA rework machine required by users should equipped with below four characteristics:

 

1.High success rate: high success rate of welding can reduce user's cost, otherwise low success rate will increase user's loss greatly, which is very important for maintenance industry.
2.High reliability: high reliability is the direct guarantee of high success rate and it can reduce manipulation strength greatly at the same time, users mastered repair equipment characteristic can not to stay by machine during welding, otherwise users will waste a lot of valuable time and it's difficult to guarantee the success rate because of low reliability.
3.Easy to operate: it can make users master of operation method as soon as possible and save operation time directly, thus improving working efficiency.
4.Applicability: due to the type and size of electronic components with BGA packaging technique are various and will be more and more kinds, PCB board's size and quality are different greatly, so the applicability is necessary. If machine's range of application is narrow, then it will be hard to meet the requirements of electronic products rapid development.