Introduction

    By employing new technologies and imported facilities, YW-YH series electroplated bond blade with hub is our company's high level product. The HT-YH series hub blades restrains tip shape collapse and provides stable processing.

 Features

Compare with blades with thickness less than 60μm. The series shows high strength , long life, excellent chip removal and no sporadic chipping on the workpiece.

Standard of Classfication

       1.Shape of hub

2.Particle size of diamond powder

3.Concentration of diamond powder

4.Hardness of Nickel Alloy

Product Ingredient

       1.Basic part: Alufer

       2.Cutting edge part: mixture with Nicked alloy and diamond

Important Parameters:

       1.Diamond grit

       2.The length of blade edge

       3.The thickness of blade edge

       4.The styles of adhesive

       5.The style of diamond concentration

       6.The specifications of slot cutters

    Above six elements is the main considerations for choosing hard blades. The specific details rely on the usage, request and working conditions.

Applications:

      1.Semiconductor discrete devices: GPP, MOSFET, SKY, Diode

       2.Integrated circuit: BGA, QFN, PCB, Epoxy, Alloy framework plastic board, Composite plate with sandwich, ceramic sbustrates LED.

3.Semiconductor Chemical compund: Gallium arsenide(GaAs) ,Gallium phosphide(GaP),Gallium arsenide phosphide.

       4.Silicon (SI) Wafer Die

       5.Others: LTCC/HTCC, Image sensor

       6.Ceramic substrate

       7.Epoxy resin version

       8.Composite board with interlayer inside, etc.