| Type: | Other |
|---|---|
| Certification: | ISO9001:2008 |
| Usage: | repair any bga chips ,like computer,laptop,mobile phone,ps3,game playe |
| Weight: | 45kg |
| Dimensions: | L635*W600*H560mm |
| Rated Capacity: | 4800W |
| Voltage: | AC220V 50/60HZ |
| Model Number: | zm-r5860 |
| Brand Name: | Seamark ZM |
| Machine type: | basic bga rework machine |
| Usage: | it can repair any bga chips |
| heaters: | hot air and Infrared combine |
| warranty: | 1 year |
| touch screen: | is available |
| Payment terms: | T/T,Paypal,western union or cash |
| experience: | ten years |
Quick Details
Specifications
basic bga rework machine ZM-R5860 laptop motherboard reballing station
hot selling and basic bga rework machine
specifications and technical parameters
|
1
|
Total Power
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4800W
|
|
2
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Top heater
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800W
|
|
3
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Bottom heater
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2nd heater 1200W,3rd IR heater 2700W
|
|
4
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Power supply
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AC220V±10% 50/60Hz
|
|
5
|
dimension
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630×650×690mm
|
|
6
|
Positioning
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V-groove, PCB support can be adjusted in any direction with external universal fixture
|
|
7
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Temperature control
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(K Sensor) closed loop, independent heating, precision within ±3°
|
|
8
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PCB size
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Max 410×370mm Min 20×20 mm
|
|
9
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Electrical selection
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Highly sensitive temperature control module+Touch screen (Taiwan)+Delta PLC
|
|
10
|
Weight
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40kg
|
1. touch screen micro computer interface, easy for new learner.
2. Show temperature curves, settings, operation etc
3. temperature precision: within 3°C
4. big pcb holding areas, for any motherboards, xbox360, ps3, phones etc
5. for personal use or repair centre
6. external camera obeserve solder balls reflow process and show it on split monitor.
7.Multifunctional PCB support shelf, can be moved along X axis,with rapid and easy PCB board positioning , suitable for all kind of PCB position
hot selling and basic bga rework machine