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Quick Details

Type: Other
Certification: ISO; CE
Usage: for repair all kinds of bga chipset from laptop,computer motherboard
Weight: 65kg (Net weight)
Dimensions: 640*630*900mm
Rated Capacity: 4800W
Current: N/A
Voltage: AC220V 50/60 HZ
Model Number: ZM-R6200
Brand Name: Seamark ZM
Place of Origin: China (Mainland)
Model: ZM-R6200 BGA rework machine
Brand name: Seamark ZM
Usage: it can repair all kinds of bga chipset from laptop,computer motherboard ,mobile phone etc
warranty: 12 month
wholelife technology support: yes
Heater: hot air & Infrared
Positioning: Laser,V groove,universal fixtures
Experience: 12 years
reballing accessories: solder ball,reballing station,reballing stencil,solder wire,flux paste etc

Specifications

Laptop repair machine Zhuomao ZM-R6200 Infrared bga reballing system
BGA reballing accessories included:solder ball (lead or lead free),universal reball kit,reballing stencil,soldering iron,hot air gun,solder wire,solder wick,flux paste,bga reballing oven etc.

Technical parameters

Total power

4800W  Max

2

Top heater power

800W   (1st heater)

3

Bottom heater power

1200W  (2nd heater)

4

3rd IR heater

2700W   (independent controlling left and right IR heaters)

5

power

AC 220V±10    50/60Hz

6

Electrical materials

temperature control system Adopted Dalian University of Technology

7

Dimensions

L640*W630*H900mm

8

Temperature control

K-type thermocouple (Closed Loop), intelligent temperature compensation system

9

Positioning

V type groove,with universal fixture

10

P C B size

Max 410×370mm, Min65×65mm


Main Feature description of Zhuomao BGA rework machine ZM-R6200
1.3 independent heating systems

ZM-R6200 is available heating portion of the PCB board by hot-air circulate both from top and bottom at the same time. Auto identifies a high degree of suction and mounting. With large IR bottom heating, it can completely avoid PCB deformation during reworking period, you can use software to choose freely or use top heater or bottom heater depart, and combine freely with top and bottom heater's capacity, to make it easies for rework double BGA, CCGA, QFN, CSP, LGA, SMD etc. External sensor socket is precise detected temperature to analyze and proof on actual temperature curve of BGA at the same time.

 

2. Precise optical alignment system

with optical alignment system and clear images, components can enlarge up to Maximum 230 times, mounting accuracy within 0.01mm, with a beam split, zoom in, zoom out and micro-adjust functions, adopted 12 inch HD monitor.

High-definition CCD color optical vision system, splitting, amplification, micro-adjust and auto focus, with automatic color resolution and brightness adjustment device.

 

3. Multi-function operation system

Touch screen interface shows current running temperature curves, what can be analyzed, saved. The temperature can be set to 6 segments and 6 segments constant temperature control, N groups of storage temperature setting parameters according to kinds of BGA chip set. With automatic soldering and desoldering functions

 

4. Precise temperature control system

K-type thermocouple, close-loop control, and intelligent temperature compensation with automatically system, Temperature accuracy is within 1 degree.

Top hot air heater and mounting head is integrated design (2 functions all in). 
 

5. Superior safety functions

After finish desoldering and soldering, there is alarming, when temperature goes out of control, the circuit will automatically power off, it is of double excess temperature protection function. Temperature parameter has a password to avoid arbitrary changes, with superior safe protection functions, can protect PCB, components and the machine from damage at any abnormal situation.
laptop bga rework machine with high precise optical alignment and qualitybga rework station zm-r6200 is good at  repair all kinds of chips


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