| Type: | Other |
|---|---|
| Certification: | ISO; CE |
| Usage: | for repair all kinds of bga chipset from laptop,computer motherboard |
| Weight: | 65kg (Net weight) |
| Dimensions: | 640*630*900mm |
| Rated Capacity: | 4800W |
| Current: | N/A |
| Voltage: | AC220V 50/60 HZ |
| Model Number: | ZM-R6200 |
| Brand Name: | Seamark ZM |
| Place of Origin: | China (Mainland) |
| Model: | ZM-R6200 BGA rework machine |
| Brand name: | Seamark ZM |
| Usage: | it can repair all kinds of bga chipset from laptop,computer motherboard ,mobile phone etc |
| warranty: | 12 month |
| wholelife technology support: | yes |
| Heater: | hot air & Infrared |
| Positioning: | Laser,V groove,universal fixtures |
| Experience: | 12 years |
| reballing accessories: | solder ball,reballing station,reballing stencil,solder wire,flux paste etc |
Quick Details
Specifications
BGA reballing accessories included:solder ball (lead or lead free),universal reball kit,reballing stencil,soldering iron,hot air gun,solder wire,solder wick,flux paste,bga reballing oven etc.
Technical parameters
| 1 |
Total power |
4800W Max |
|
2 |
Top heater power |
800W (1st heater) |
|
3 |
Bottom heater power |
1200W (2nd heater) |
|
4 |
3rd IR heater |
2700W (independent controlling left and right IR heaters) |
|
5 |
power |
AC 220V±10 50/60Hz |
|
6 |
Electrical materials |
temperature control system Adopted Dalian University of Technology |
|
7 |
Dimensions |
L640*W630*H900mm |
|
8 |
Temperature control |
K-type thermocouple (Closed Loop), intelligent temperature compensation system |
|
9 |
Positioning |
V type groove,with universal fixture |
|
10 |
P C B size |
Max 410×370mm, Min65×65mm |
Main Feature description of Zhuomao BGA rework machine ZM-R6200
1.3 independent heating systems
ZM-R6200 is available heating portion of the PCB board by hot-air circulate both from top and bottom at the same time. Auto identifies a high degree of suction and mounting. With large IR bottom heating, it can completely avoid PCB deformation during reworking period, you can use software to choose freely or use top heater or bottom heater depart, and combine freely with top and bottom heater's capacity, to make it easies for rework double BGA, CCGA, QFN, CSP, LGA, SMD etc. External sensor socket is precise detected temperature to analyze and proof on actual temperature curve of BGA at the same time.
2. Precise optical alignment system
with optical alignment system and clear images, components can enlarge up to Maximum 230 times, mounting accuracy within 0.01mm, with a beam split, zoom in, zoom out and micro-adjust functions, adopted 12 inch HD monitor.
High-definition CCD color optical vision system, splitting, amplification, micro-adjust and auto focus, with automatic color resolution and brightness adjustment device.
3. Multi-function operation system
Touch screen interface shows current running temperature curves, what can be analyzed, saved. The temperature can be set to 6 segments and 6 segments constant temperature control, N groups of storage temperature setting parameters according to kinds of BGA chip set. With automatic soldering and desoldering functions
4. Precise temperature control system
K-type thermocouple, close-loop control, and intelligent temperature compensation with automatically system, Temperature accuracy is within 1 degree.
Top hot air heater and mounting head is integrated design (2 functions all in).
5. Superior safety functions
After finish desoldering and soldering, there is alarming, when temperature goes out of control, the circuit will automatically power off, it is of double excess temperature protection function. Temperature parameter has a password to avoid arbitrary changes, with superior safe protection functions, can protect PCB, components and the machine from damage at any abnormal situation.
laptop bga rework machine with high precise optical alignment and qualitybga rework station zm-r6200 is good at repair all kinds of chips
Any Doubt ?
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