| Place of Origin: | |
|---|---|
| Brand Name: | Seamark ZM |
| Model Number: | ZM-R5860 |
| Voltage: | AC220V 50/60HZ |
| Current: | |
| Rated Capacity: | 4800W |
| Rated Duty Cycle: | |
| Dimensions: | L635*W600*H560mm |
| Weight: | 45kg |
| Usage: | replace motherboards, xbox360, ps3, mobiles |
| Certification: | ISO,CE |
| After-sales Service Provided: | Overseas service center available |
| color: | black |
| warranty period: | 1 year free |
| package: | standard wooden case |
| certificate: | ISO,CE |
| weight: | 45kg |
| type: | reflow rework |
| usage: | repair all kinds of bga chips from game player,computer,television,mobile and so on. |
| heatings: | hot air and infrared combine,three heaters in t |
| MOQ: | 1set |
Quick Details
Specifications
specifications and technical parameters
Upgraded bga repair mobiles machine zm-r5860.
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1
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Total Power
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4800W
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2
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Top heater
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800W
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3
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Bottom heater
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2nd heater 1200W,3rd IR heater 2700W
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4
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Power supply
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AC220V±10% 50/60Hz
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5
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dimension
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630×650×690mm
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6
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Positioning
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V-groove, PCB support can be adjusted in any direction with external universal fixture
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7
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Temperature control
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(K Sensor) closed loop, independent heating, precision within ±3°
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8
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PCB size
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Max 410×370mm Min 20×20 mm
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9
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Electrical selection
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Highly sensitive temperature control module+Touch screen (Taiwan)+Delta PLC
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10
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Weight
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40kg
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Upgraded bga repair mobiles machine zm-r5860.
1. touch screen micro computer interface, easy for new learner.
2. Show temperature curves, settings, operation etc
3. temperature precision: within 3°C
4. big pcb holding areas, for any motherboards, xbox360, ps3, phones etc
5. for personal use or repair centre
6. external camera obeserve solder balls reflow process and show it on split monitor.
7.Multifunctional PCB support shelf, can be moved along Shenzhen Seamark ZM basic bga repair machine hot air and infrared X axis,with rapid and easy PCB board positioning , suitable for all kind of PCB position
Upgraded bga repair mobiles machine
Upgraded bga repair mobiles machine zm-r5860.