This system adopts laser heating to solid thermal sensitive gel, which has advantages of low energy consumption, high efficiency, high consistency and space saving, it is suitable for automatic pipeline production.

Product Features

1. Temperature uniformity, with high consistency curing effects. 
2. Processing multiple points simultaneously, high efficiency and high productivity 
3. Easy to process micro splicing points. 
4. Multiple laser channels can be independently controlled, and intellectual temperature control system is optional. 
5. No needs to heating the whole components, with least heating influence and high yields 
6. Customized design upon special pipeline is also welcome. 

Application Field

It mainly applies for gel curing in micro-electronics, precision optical components, micro machinery, photo-communication, such as PCB assembling, chips splicing, laser module sealing, electronics module packaging, Hard disk magnetic head bonding, connector/digital products joints sealing.

Technical Specifications