1.The definition of  COG bonding machine XCG93-C1(the pressure):

COG bonding equipment (the pressure) referred to as "bonding machine," "hot-press", COG bonding equipment is to determine the IC chip on top of LCD glass finishing and binding equipment, machine controlled by a PLC + HMI composition core products in the completion of the bits and transmitted by the platform after preloading pressure to bind the crimp. Using ACF (Anisotropic conductive adhesive) by pressing the IC bonding directly to the LCD screen. After bonding the entire module is also through FPC (flexible printed circuit board) metal pin and PCB board connector or together. LCD screen, ACF, the driver IC are the three key components of COG.

2.The alternative name of  COG bonding machine XCG93-C1(the pressure):

According to the application and promotion of COG bonding machine XCG93-C1(the pressure) ,there are  a variety of different keywords. Such as: Bonding machine, pressing machine, COG pressing machine, COG bonding machine, LCD screen repair machines, COG pressing equipment, temperature bonding machine, constant temperature hot bonding machines, small and medium-size LCD screen bonding machine, LCM Pradesh machines, modular hot bonding machine, LCD COG bonding machine, cable bonding machines, cable bonding equipment, COG pressure IC devices, COG thermostat pressing machine, COG IC thermostatic pressure machine, COG thermostat this laminate machine,  LCD IC pressing machine, COG thermostatic pressing equipment, COG thermostatic pressure IC devices, COG crimping machine, COG thermostatic the pressure equipment, COG constant temperature of the press, IC bonding machine , IC bonding equipment, IC pressing machine, LCD bonding machine, modular bonding machines, LCD bonding machine, LCD screen pressing machine, module pressing machine , LCD pressing machine, COG heated process equipment, COG thermostatic pressure IC devices, IC constant temperature bonding machine, IC thermostat bonding equipment and so on.

3.About the classification of COG bonding machine XCG93-C1(the pressure):

1, classified according to the fuction
1.1 Unilateral single IC bonding 
1.2 Multilateral multiple IC bonding 
1.3 unilateral multiple IC bonding 
2,classified according to the degree of automation:  
2.1 Semi-COG bonding equipment (preload) 
2.2 Automatic COG bonding equipment (pre-press) 
3, classified according to COG process:  
3.1 COG counterpoint preload
3.2 COG bonding the pressure
3.3 COG pre-bonding the pressure
4, classified according to the way of stage work:
4.1 stage X-Y-θ-axis micrometer manual adjustment
4.2 stage X-Y-θ-axis DD motor automatically adjustment 
5, classified according to procedure combinations:
5.1 ACF + COG preload 
5.2 ACF + COG preload  + COG  the pressure 
5.3 Cleaning + ACF + COG preload + COG  the pressure 
5.4 Cleaning + ACF + COG preload  +COG  the pressure  + COG of the particle detector

4.About the application field of COG bonding machine XCG93-C1(the pressure):

COG bonding equipment (the pressure) is widely used in a variety of LCD display (LCD), modules (LCM) and large-sized display panel production, assembly, maintenance, production enterprises; such as: mobile phones, laptops, LCD monitors, tablet PCs, LCD / LCM production, assembly, repair enterprises.

5.About the working principle of  COG bonding machine XCG93-C1(the pressure):

The working principle of COG bonding equipment (the pressure) is make the attached IC , ACF's LCD, LCM assembled and bound in the (LCM) module production, maintenance and production process .using the head pressure, head temperature, bonding time, optical alignment system to make  IC, LCD and LCM, ACF glue bound  ,so that it can conduct.

6.About the COG bonding machine XCG93-C1(the pressure)  's competitive advantage:

6.1 SUNSOM patent (Patent No. ZL201120120232.2): SUNSOM pressure system cylinder head structure can eliminate weight, pressure accurate. 
6.2 thermostatic heating curve with digital temperature display synchronization, the thermocouple output parameters can be adjusted according to the head power. 
6.3 Imported PLC controller, can store 500 groups of function parameters. 
6.4 The system can automatically store the location of each IC, the operation may need to go to repair the IC automatically position.

7.Basic parameters of XCG93-C1

Input Power: AC220V 50-60HZ 
Vacuum control: vacuum + vacuum generator; 
Dimensions: L1000 * W1050 * H1475mm (excluding warning lights) 
Operating modes: 7-inch HMI 
Control system (LG-LS): a programmable processor 
Pressure gauge: KITA, the number of explicit 
Pressure regulator: Japan SMC, precision pressure regulating valve 
Pressure accuracy: ± 0.5% full in the degree 
Sensitivity: 0.2% full in the degree 
Pressure Unit: Kg / N / Mpa / Kpa swap 
counterpoint mode: CCD next counterpoint 
Platform Work: Fixed 
Platform Material: high quality Bakelite 
Heating: heating thermostat 
Thermocouple: K type 
Blade material: 440C 
Temperature range: RT-500 ℃
8.About the functions and characteristics of COG bonding machine XCG93-C1(the pressure):

8.1 heating curve with digital temperature display synchronization. 
8.2 can store 500 groups of function parameters. 
8.3 thermocouple output parameters can be adjusted according to the head power. 
8.4 SUNSOM twin eliminate structural weight, pressure accurate.