| Place of Origin: | China (Mainland) |
|---|---|
| Brand Name: | Huaray |
| Model Number: |
Quick Details
Specifications
Spruce-355/5 A UV laser Integration, to integrate the outside light path into cavity, fully meet the needs of laser marking industry fast integration, not only greatly reduces the integration difficulty of laser equipment, its optimized cavity structure and connection system, more can ensure the high stability and high reliability of the system, ensure the quality of light path and has excellent adjustability.
Features:
Stable output of power and pulse width
Excellent beam quality, M2<1.2
High beam pointing stability
Wide repetition rate range:20-200kHz
Controllable with RS232 interface
Unique Intracavity frequency doubling technology.
Triggerable external
Applications:
Mainly applied in ceramic cutting, scribing and marking, and material micromachining, laser rapid prototyping, FPCB cutting, millipore(d≤10μm) punching, flexible PCB marking and scribing, removal of metal and non-metal coating, processing of silicon wafers' millipores and dead holes.
Features:
Stable output of power and pulse width
Excellent beam quality, M2<1.2
High beam pointing stability
Wide repetition rate range:20-200kHz
Controllable with RS232 interface
Unique Intracavity frequency doubling technology.
Triggerable external
Parameters
| Model | Spruce-355/3 A | Wavelength | 355nm |
| Average Power | >3W@50kHz | Pulse Repetition Rate | 20kHz-200kHz |
| Spatial Mode | TEM00(M2≤1.2) | Beam Roundness | ≥90% |
| Pulse Width | <15ns@40kHz | Working Material | Nd:YVO4 |
| Beam-pointing | <25μrad | Pulse-to Pulse Stability | ≤3%rms |
| Long-Term Stability | ≤3%rms | Beam Diameter | ≤7mm |
| Beam Divergence | ≤2mrad | Cooling | water |
| Polarization Ratio | >100:1 | Operating Voltage | AC220 or AC110 |
| Power Consumption | 500W | Classfication | Class 4 |
Applications:
Mainly applied in ceramic cutting, scribing and marking, and material micromachining, laser rapid prototyping, FPCB cutting, millipore(d≤10μm) punching, flexible PCB marking and scribing, removal of metal and non-metal coating, processing of silicon wafers' millipores and dead holes.