| Place of Origin: | China (Mainland) |
|---|---|
| Brand Name: | Huaray |
| Model Number: | Spruce-532/10 A Spruce-532/10 B |
Quick Details
Specifications
Spruce-532/10 Green Laser are featured with firm structure, low power consumption, excellent long term stability and beam quality. It is especially suitable for FPD and solar film processing industry. With reliable and compact architecture, this laser is with small volume and externally triggered, Huaray provide different power and repetition frequency to meet different customer's demands.
Features
Stable output of power and pulse width
Excellent beam quality, M2<1.2
High beam pointing stability
Wide repetition rate range:20-200kHz
Controllable with RS232 interface
Unique Intracavity frequency doubling technology.
Triggerable external
Parameters
Applications
Mainly applied in processing of surface finishing or coating film of metal and non-metal materials, such as hardware, ceramics, glasses, clocks, PC, electronic devices, various types of instrumentation, PCB and control panel, plate panels, plastic and other thin film solar etching; silicon wafer; glass, ceramic marking and scribing.
Features
Stable output of power and pulse width
Excellent beam quality, M2<1.2
High beam pointing stability
Wide repetition rate range:20-200kHz
Controllable with RS232 interface
Unique Intracavity frequency doubling technology.
Triggerable external
Parameters
| Model | Spruce-532/10 B | Wavelength | 532nm |
| Average Power | >10W@50kHz | Pulse Repetition Rate | 20kHz-200kHz |
| Spatial Mode | TEM00(M2≤1.2) | Beam Roundness | ≥90% |
| Pulse Width | <15ns@50kHz | Working Material | Nd:YVO4 |
| Beam-pointing | <25μrad | Pulse-to Pulse Stability | ≤3%rms |
| Long-Term Stability | ≤3%rms | Beam Diameter | ≤1.2mm |
| Beam Divergence | ≤2mrad | Cooling | water |
| Polarization Ratio | >100:1 | Operating Voltage | AC220 or AC110 |
| Power Consumption | 600W | Classfication | Class 4 |
Applications
Mainly applied in processing of surface finishing or coating film of metal and non-metal materials, such as hardware, ceramics, glasses, clocks, PC, electronic devices, various types of instrumentation, PCB and control panel, plate panels, plastic and other thin film solar etching; silicon wafer; glass, ceramic marking and scribing.