Conductor width/spacing: 4 mils
Aspect Ratio: 1: 16
Min Finish hole diameter: 0.10mm
Multi-layers: Up to 16 layers
Board thickness: Minimum 0.25mm, Maximum 3.8mm
Solder Mask: LPI, Peelable ink, Carbon ink
Legend: Two Part epoxy and UV
Surface Finishes: HASL, Flash Gold, Immersion Silver, Immersion Tin, Immersion Ni/Au, OSP, Selective Hard Gold.
Electrical Test: Voltage: 10-250V
Profiling: Punching, Routing, V-Cut
Gold finger thickness: 1-1.2 μ M (Au)
Maximum panel size: 610 mm X 508 mm (24" X 20")
Impedance Control: +/- 10%
PCB Assemblies Services

Surface Mount Technology (SMT)
Through Hole Circuit Boards (PTH)
Mixed Technology PCB
Functional Testing
Box Build; Full Assemblies
BGAs and CCGAs
Micro and Fine Pitch BGAs
SMT 24" x 30"for press fit Backplanes
CGA's to 1.0mm PBGA's,
UBGA's CSP, s to 0.5mm
Leaded parts to 0.3 mm
Chips and discretes to 0402
Automatic wave solder 18" max board width *__ length
Selective soldering capabilities - no board size limitation