Place of Origin: | China (Mainland) |
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Quick Details
Specifications
Specifications
vSGS:12024915-G2
ROHS:SP10-003347-SH
UL:E302512-080423
SGS:12409491-GZ
ROHS:SP10-003347-SH
UL:E302512-080423
SGS:12409491-GZ
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Features:
- Applicable PCB (L x W): 50 × 50 to 700 × 460mm
- Minimum component: 0201
- Minimum QFP pitch: 0.4mm
- Minimum IC pitch: 0.30mm
- Minimum BGA ball diameter: 0.40mm
- Ball pitch: 1.0mm
- Maximum BGA size: 74x74mm
- Service include: PCB layout and BOM design or copying, component procurement, SMT, DIP, enclosure assembly, test, and packing.
- Mounting capability: 9,000,000 chips a day
- DIP: 700,000 pieces a day
- We are planning to prepare 2 lines more this year
- Applications of our product: SMPS, PCI, mother board, controller, CCTV, telecommunication, DVD, MP3, GPRS, military, and more
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Advantages:
- Shenzhen has the biggest electronic market
- We can procure most of component in the shortest at the lowest price
- We have good business relationship with main IC manufacturers, such as NS, TI, ON, Fairchild, ST, Microchip, and more
- We have our own PCB factory, can offer one-stop service for client
- Our employees are experienced and stable
- High-precision machine and equipment can guarantee quality. X-ray, AOI, visual checking and function test confirm our delivery goods 100% past
- No MOQ
- All inquiries will be replied within 2 hours
- Competitive price and short lead-time
- Rich experience in importing and exporting
- Good relationship with all kinds of for warder