Total power

Max 5300W

2

Top hot air heater

1200W

3

2^nd hot air heater

1200W

4

3^rd IR preheater

2700W

5

Voltage

210V-240V,50/60HZ

6

Main structure parts

Touch screen+ PLC+ High sensitive temp control module+ CCD color optical system

7

Temp control

K-sensor closed-loop,

8

PCB positioning

V-groove ,with universal fixture ,can move easily

9

PCB size

Max 410×370mm; Min65×65mm

10

BGA chip size

1×1~ 80×80mm

11

External temp sensor

1 piece

12

Dimensions

640×630×900mm

13

Machine body net weight

65kg

1

There are 3 independent heating areas in this BGA rework station,the 1st and 2nd are hot-air heaters, the 3rd is IR preheating aera, temp precision is approximately within 3 degree;

2

Upper heater can heat from top of BGA chip and bottom of pcb board, can set up many groups of profiles ,IR preheating area can be adjusted according to actual requirements, so that the pcb board can be heated evenly;

3

Can partly heat BGA chip and pcb board at the same time,also large aera of IR preheating for PCB bottom is done to avoid pcb deformation in BGA rework process;

4

Adopt high-precision K-sensor closed-loop temp control as well as PID profiles automatic adjusting system; display 4 profiles and memory several groups of user's profiles, can analyze profiles in a short time; external temp sensor can detect temp precisely,can analyze and proof acquired profiles;

5

Due to optical alignment system,image is displayed clearly in the LCD monitor,maximum magnification is 230 times of the BGA ball, mounting precision is within 0.01mm;

6

with fuction of spectrophotometric, two-color ,zoom,micrify,micro-adjustment,with 15 inch high-definition mornitor;

7

Adopt HD touch screen, you can set up " set up interface" and " operation interface" , to prevent error-setting in bga rework ;

8

Top hot air heater and mounting head 2 in 1 designing method, can automaticially detect height for suction and mounting,can solder and desolder automaticially;can set 6 segments of rising temperature and 6 segments of constant temperature,can memory N groups of temp profiles,which can be used at any time.

9

With all sizes of Titanium alloy BGA nozzles, can be rotated 360 degree,easy to place and change.

10

Adopt V-groove pcb support to position PCB easily, precisely and repaidly;can satisfy all sizes and versions of PCB board; Also apply for smart movable universal fixture for positioning,to pretect BGA chip being damaged on the edge and pcb deformation,to ensure the motherboard repair success rate, and fit for all size of BGA rework;

11

Have CE certificate and ISO9001:2008 Quality Certificate.

12

Have Emergency-stop switch and automatic power outage protection device in abnormal accident;Can alarm after bga soldering and desoldering,can power off automaticially when temp is out of control;can protect the machine whenever temp is too high or too low.

13

Safety protecting function can protect temp by password or profiles being abonormal situations it can protect PCB boards, bga chip and machine itse