COG bonding machineXCG73-A1 (The pre-press)
1 About the definition of COG bonding machineXCG73-A1 (The pre-press)
2 About the COG bonding machineXCG73-A1 's (The pre-press) alternative name
3 About the classification of COG bonding machineXCG73-A1 (The pre-press)
4 About the application field of  COG bonding machineXCG73-A1 (The pre-press)
5 About the working principle of COG bonding machineXCG73-A1 (The pre-press)
6 About the COG bonding machineXCG73-A1 's (The pre-press) competitive advantage
7 About the basic parameters of COG bonding machineXCG73-A1 (The pre-press)
8 About the functions and characteristics of COG bonding machineXCG73-A1 (The pre-press)
1.The definition of  COG bonding machineXCG73-A1 (The pre-press):
COG bonding equipment (The pre-press) referred to as "bonding machine," "hot-press", COG bonding equipment is to determine the IC chip on top of LCD glass finishing and binding equipment, machine controlled by a PLC + HMI composition core products in the completion of the bits and transmitted by the platform after preloading pressure to bind the crimp. Using ACF (Anisotropic conductive adhesive) by pressing the IC bonding directly to the LCD screen. After bonding the entire module is also through FPC (flexible printed circuit board) metal pin and PCB board connector together. LCD screen, ACF, the driver IC are the three key components of COG.

2.The alternative name of  COG bonding machineXCG73-A1 (The pre-press):
According to the application and promotion of COG bonding machineXCG73-A1 (The pre-press) ,there are  a variety of different keywords. Such as: Bonding machine, pressing machine, COG pressing machine, COG bonding machine, LCD screen repair machines, COG pressing equipment, temperature bonding machine, constant temperature hot bonding machines, small and medium-size LCD screen bonding machine, LCM Pradesh machines, modular hot bonding machine, LCD COG bonding machine, cable bonding machines, cable bonding equipment, COG pressure IC devices, COG thermostat pressing machine, COG IC thermostatic pressure machine, COG thermostat this laminate machine,  LCD IC pressing machine, COG thermostatic pressing equipment, COG thermostatic pressure IC devices, COG crimping machine, COG thermostatic The pre-press equipment, COG constant temperature of the press, IC bonding machine , IC bonding equipment, IC pressing machine, LCD bonding machine, modular bonding machines, LCD bonding machine, LCD screen pressing machine, module pressing machine , LCD pressing machine, COG heated process equipment, COG thermostatic pressure IC devices, IC constant temperature bonding machine, IC thermostat bonding equipment and so on.

3.About the classification of COG bonding machineXCG73-A1 (The pre-press):
1, classified according to the fuction
1.1 Unilateral single IC bonding 
1.2 Multilateral multiple IC bonding 
1.3 unilateral multiple IC bonding 
2,classified according to the degree of automation:  
2.1 Semi-COG bonding equipment (preload) 
2.2 Automatic COG bonding equipment (pre-press) 
3, classified according to COG process:  
3.1 COG counterpoint preload
3.2 COG bonding The pre-press
3.3 COG pre-bonding The pre-press
4, classified according to the way of stage work:
4.1 stage X-Y-θ-axis micrometer manual adjustment
4.2 stage X-Y-θ-axis DD motor automatically adjustment 
5, classified according to procedure combinations:
5.1 ACF + COG preload 
5.2 ACF + COG preload  + COG  The pre-press 
5.3 Cleaning + ACF + COG preload + COG  The pre-press 
5.4 Cleaning + ACF + COG preload  +COG  The pre-press  + COG particle detector

4.About the application field of COG bonding machineXCG73-A1 (The pre-press):
COG bonding equipment (The pre-press) is widely used in a variety of LCD display (LCD), modules (LCM) and large-sized display panel production, assembly, maintenance, production enterprises; such as: mobile phones, laptops, LCD monitors, tablet PCs, LCD / LCM production, assembly, repair enterprises.

5.About the working principle of  COG bonding machineXCG73-A1 (The pre-press):
 The working principle of COG bonding equipment (The pre-press) is make the attached IC , ACF's LCD, LCM assembled and bound in the (LCM) module production, maintenance and production process .using the head pressure, head temperature, bonding time, optical alignment system to make  IC, LCD and LCM, ACF glue bound  ,so that it can conduct.

6.About the COG bonding machineXCG73-A1 (The pre-press)  's competitive advantage:
6.1 SUNSOM patent (Patent No. ZL201120120232.2): SUNSOM pressure system cylinder head structure can eliminate weight, pressure accurate. 
6.2 thermostatic heating curve with digital temperature display synchronization, the thermocouple output parameters can be adjusted according to the head power. 
6.3 Imported PLC controller, can store 500 groups of function parameters. 
6.4 The system can automatically store the location of each IC, the operation may need to go to repair the IC automatically position.
7.Basic parameters of XCQ77-A1
Input Power: AC220V 50-60HZ 
Rated power: 1.5KW 
Temperature range: RT-500 ℃; 
Working pressure :0.4-0 .8 MPa 
Product registration adjustment: X.Y.θ 
Fine-tuning; gas consumption: ≈ 50L/min; 
counterpoint mode: CCD next counterpoint; 
Indenter size: (can be selected) 
Thermocouple: K type 
Pressure Unit: Kg / N / Mpa / Kpa interchangeable; 
Program control: PLC controller 
Heating: heating thermostat 
Operating modes: 7-inch HMI
8.About the functions and characteristics of COG bonding machineXCG73-A1 (The pre-press):
8.1 Heating curve with digital temperature display synchronization. 
8.2 Can store 500 groups of function parameters. 
8.3 Thermocouple output parameters can be adjusted according to the cutting head power. 
8.4 SUNSOM twin eliminate structural weight, pressure accurate.