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Board Thickness: 1.6mm
Base Material: Aluminun

Specifications

  • Specification:
    • Material: aluminum
    • Board thickness: 1.6mm
    • Thermal conductivity: 1.0W/MK
    • Thermal resistance range: 0.6-0.8°C/W
    • CTI: >600
    • TMA = 0.35
    • Dielectric constant: 5.2
    • TG: >130
    • Dielectric layer thickness range: 100-150um
    • Special substrate: domestic aluminum plate, Taiwan domestic aluminum plate, Bergquist material, Japan aluminum plate
    • Maximum production size: 500*600, 500*1,200, 1,200*1,200mm
    • Outline tolerance: punching (±0.1), CNC (±0.12), V-cut (±0.2)
    • Minimum hole size: 0.25mm
    • Peel strength: 1.8-3n/mm
    • Breakdown voltage: >2.5K-6K
    • Solder dip resistance: 300°C/W
    • Thermal resistance: <0.43°C/W
    • Surface finished: HASL
    • Soldermask: black color
  • Application: LED products
  • Lead time:
    • Sample: 3-5 days
    • Production: 5-7 days
  • Other information:
    • MOQ: 1pc
    • Certifications: ISO, CE, RoHS, UL
    • Test: 100% testing