| Usage: | Auto Testing Machine |
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| Power: | Electronic |
| Model Number: | BND-TSL |
| Brand Name: | BONAD |
| Place of Origin: | China (Mainland) |
| Payment: | negotiate |
| Quality: | high quality |
| Warranty: | one year |
| Standards: | ISO9001 |
| Delivery: | 4-6 weeks |
Quick Details
Specifications
Three box-type Thermal shock Chamber
BND-TSL
Purpose:
It is necessary test equipment for the aerospace, automotive, home appliances, research and other fields, used for examination and identification of parameters, performance and the use of adaptive of electrical, electronics, automotive electronics, materials and other products, after making high and low temperature impact test. Applied to schools, factories, military, research, and other organizations
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Product Spec.and Technical parameter table |
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model |
TS(L)S-80 |
TS(L)S-100 |
TS(L)S-150 |
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performance |
Preheat room |
Upper limit preheat temperature |
200oC |
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Heating time |
﹢20～﹢200oC≈20min |
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Precool room |
Lower limit precool temperature |
﹣75oC |
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Cooling time |
﹢20～﹣70oC≈80min |
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Workroom |
Temperature shock range |
(－55oC～－10)～(50～﹢150oC) |
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Temperature fluctuation |
≤±0.5oC |
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Temperature deviation |
≤±2oC |
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Temperature revert time |
≤5min |
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Temperature revert |
CJ602S3Ⅰ |
Condition 1 |
sample load: 10kg with plastic package IC; sample exposed: 30min in ﹢125oC,30min in ﹣40oC |
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Condition 2 |
sample load: 10kg with plastic package IC; sampl exposed :30min in ﹢150oC, 5min in ambient temp,30min in ﹣55oC |
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CJ602S3Ⅱ |
Condition 1 |
sample load: 20kg with plastic package IC; sample exposed: 30min in ﹢125oC,30min in ﹣40oC |
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Condition 2 |
sample load: 20kg with plastic package IC; sampl exposed :30min in ﹢150oC, 5min in ambient temp,30min in ﹣55oC |
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Condition 3 |
sample load: 7.5kg with plastic package IC; sample exposed: 30min in ﹢150oC,30min in ﹣55oC |
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CJ603S3Ⅰ |
Condition 1 |
sample load: 10kg with plastic package IC; sample exposed: 30min in ﹢125oC,30min in ﹣40oC |
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Condition 2 |
sample load: 10kg with plastic package IC; sampl exposed :30min in ﹢150oC, 5min in ambient temp,30min in ﹣55oC |
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CJ603S3Ⅱ |
Condition 1 |
sample load: 20kg with plastic package IC; sample exposed: 30min in ﹢125oC,30min in ﹣40oC |
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Condition 2 |
sample load: 20kg with plastic package IC; sampl exposed :30min in ﹢150oC, 5min in ambient temp,30min in ﹣55oC |
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Condition 3 |
sample load: 10kg with plastic package IC; sample exposed: 30min in ﹢150oC,30min in ﹣55oC |
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CJ605S3Ⅰ |
Condition 1 |
sample load: 10kg with plastic package IC; sample exposed: 30min in ﹢125oC,30min in ﹣40oC |
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Condition 2 |
sample load: 10kg with plastic package IC; sampl exposed :30min in ﹢150oC, 5min in ambient temp,30min in ﹣55oC |
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CJ605S3Ⅱ |
Condition 1 |
sample load: 20kg with plastic package IC; sample exposed: 30min in ﹢125oC,30min in ﹣40oC |
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Condition 2 |
sample load: 20kg with plastic package IC; sampl exposed :30min in ﹢150oC, 5min in ambient temp,30min in ﹣55oC |
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Condition 3 |
sample load: 10kg with plastic package IC; sampl exposed :30min in ﹢150oC,30min in ﹣55oC |
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construction |
shell |
cooling steel plate,surface spray |
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inner |
steel plate |
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refrigeration |
insulate |
Rigid Polyurethane Foam+extra-fine glass-wool |
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mode |
cascade refrigerating compressor |
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