| Model Number: | HC120 |
|---|---|
| Brand Name: | Bonyx |
| Place of Origin: | China (Mainland) |
| Color: | Varied |
| Thermal Conductivity: | >=1.7 |
| Thermal Impedance: | 1.7+0.1 |
| Hardness: | 30+-5mm |
| Continuous Use Temp: | -40~+220C |
| Dielectric Breakdown Voltage: | >=6 |
| Dielectric Constant: | >=5.5 |
| Flame Rating: | V-0 |
| Thickness: | 0.3~12+-10% |
| Type: | Electronic accessories |
Quick Details
Specifications
Product Description:
HC Series Silicon thermal conductive pad is high performance thermal conductive gap filling material,
mainly used for thermal interface between electronic components and heat sink or product outer covering.
According to the different needs of customers to cut into various types of soft silicon film
Product Features:
* Excellent thermal conductivity
* Self-adhesive, natural sticky, no extra surface added adhesives
* Soft and flexible
* SGS
Product Application:
* Communication Equipment
* LED lighting
* Switch power supply
* Backlight module
* Medical equipment
* Mobile equipment
* Video equipment
* Networking equipment
* Household equipment
* PC server/ workstations
Application Modes:
* Filling between PCB and heat sink
* Filling between IC and heat sink or product outer covering
* Filling between IC and other cooling devices
| Property | Test results | Unit | Test method |
| Color | Varied | -- | Visual |
| Thickness | 0.3~12±10% | mm | ASTM D374 |
| SpecificGravity | 1.7+0.1 | g/cm3 | ASTM D792 |
| Hardness | 30±5 | Shore C | ASTMD2240 |
| Continuous Use Temp | -40~+220 | ℃ | EN344 |
| Dielectric Breakdown Voltage | ≥6 | Kv | ASTM D149 |
| Dielectric Constant | ≥5.5 | ℃-in2/W | ASTM D150 |
| Vloume Resistivity | >1.2×1011 | Ω.cm | ASTM D257 |
| Flame Rating | V-0 | -- | UL-94 |
| Thermal Conductivity | ≥1.7 | W/mk | ASTMD5470 |