Main Features:

 

1. Pogo Pin Solution.

 

2. Engineering Material.

 

3. Adopt Torlon As The Insulation Material.

 

4. Compatible With 153 and 169.

 

5. Accurate Positioning On Test Pad or Solder Ball.

 

6. Long Life Span, High Quality and Stable Performance.

 

7. Pressure Ajustable Design So As To Compatible With IC Thickness From 0.8-1.5mm.

 

8. Realization Of Reading and Access The Data Of NAND Flash-eMMC

 

9.Compatible With Samsung,Hynix,Sandisk,Toshiba,Intel,etc.

 

10.Could Apply To ≤ eMMC5.0 C5.0(Please Note)

 

11. Apply IC Size: 11.5x13mm/12x16mm/12x18mm/14x18mm/11x10mm.