Product Main

Specifications

eMMC BGA Socket  Apply to Chip Size 12 X 18_0.5mm

Avaliable Chip Thickness From 0.8-1.5mm

Could read and rewrite the data of eMMC with this
 
Easy to operate,insert the SD adapter into your PC, then could read
 
Support flat bottom and solder ball testing
 
Long Life Time Nand Test Socket,Manufacturer Selling Directly
 
Apply to Samsung,Sandisk,Toshiba,Hynix,Micron,HTC,MTK,Intel, etc
 
eMMC Apply to BGA153 and BGA169
 
Accurate positioning on flat bottom pad and solder of eMMC
 
Apply to eMMC thickness:0.8--1.5mm

 

 

 


 

 

Packaging Details
Unit Type:
piece
Package Weight:
0.050kg (0.11lb.)
Package Size:
12cm x 11cm x 9cm (4.72in x 4.33in x 3.54in)