1V1 resin bond diamond grinding wheel for Semiconductor materials    

 

Characteristics:

1. for grooving and cutting with less procedure

2. Ultra-thin, High precision, Super hardness

3. Minimum thickness: 0.18mm

4. Max speed: 30K rounds/min.

5. Cutting speed: 5~10mm/sec.

6. Grit size(granularity): 80#~2000#

7. Cutting precision: ±0.005mm

8. Electroconductive

9. Working condition: dry or wet cutting

10. Additional function: slots for removing chips

11. Single wheel or bundle, both are available

12. Body core(steel/alumina) is enhancive

 

Available Material:

1. Diamond

 2. Metal-bond diamond (hold the grits strongly, good wear resistance&shape maintenance)

3. Resin-bond diamond (the elastic resin bond makes the surface improved, super sharp)

4. CBN (mainly used for high-hardness materials grooving and cutting, like tool steel, mould steel, heat-resistant steel, stainless steel, casting iron etc.)

 

Can be used for cutting:

1. Semiconductor materials

2. Oxide ceramic materials

3. Magnetic materials

4. Crystal, glass, quartz, carbide...etc.

 

Features:

1. Resin diamond wheel for PCD  cutting tools, carbide cutting tools 2.Superior Edge Quality 3.Increased Production Rates 4.Long Life 5.Guaranteed Consistency 6.Custom Engineered Products Available

7. Increased feed rates

8. Good shaped

9. No dressing tools and less heat occurs to avoid burning the workpiece are just some of the advantages of our grinding wheels can provide for you. And the dynamic balance can achieve at G0.4 for our vitrified wheels.