Product Main

Specifications

Our Advantages

1. PCB manufacturing, PCB assembly and PCB design services with 17 years experience

2. ISO UL & RoHS certified by third-party testing and high-quality technical service team

3. Producing capacity 45000 square meters per month

4. Competitive factory direct price with NO MOQ

5. Flying probe test for free

 

Standard Technique

Base material

FR-4/ FR-1/ FR-2/ CEM-1/CEM-3, Aluminum, Metal based

Layer count

2-18

Thickness of finished panel

0.20mm - 4.0mm 

Board Thickness Tolerance

±10%

Inner layer/Outer layer Base Cooper thickness

0.5 OZ(17 um)/ 0.5 OZ(17 um)

Impedance tolerance

 ±10%

Impedance Control

50Ω

Warp & Twist

≤0.5%

Peel strength of line

≥61 B/in (≥107g/mm)

Images:

Outer layer line width (a)

0.075mm (3 mil)

Outer layer line space(b)

0.075mm (3 mil)

Image to image tolerance

±0.075mm (±3 mil)

SMD pitch (a)

0.2 mm(8 mil)

BGA pitch (b)

0.2 mm (8 mil)

Solder Mask:

Thickness of solder mask (line end)

0.4-1.2 mil

 Thickness of solder mask (line corner)

≥0.2 mil

Hardness of solder mask

6 H

Solder mask registration tolerance

±2 mil

Holes:

Min drilling diameter

0.15 mm

Min diameter of finished hole

0.10 mm

Tolerance of PTH diameter

±2mil (± 50um)

Tolerance of NPTH diameter

±1mil (± 25um)

Surface treatment:

HASL

Gold finger

Lead free HASL

Au Panel

ENIG

 

OSP

 

Outline:

Max nickel thickness of gold finger

280u" (7um)

Max gold thickness of gold finger

60u" (1.5um)

Certification:

ISO14001, ISO9001, UL and RoHS