Main Features:
1.3 independent heating systems
ZM-R6200 is available heating portion of the PCB board by hot-air circulate both from top and bottom at the same time. Auto identifies a high degree of suction and mounting. With large IR bottom heating, it can completely avoid PCB deformation during reworking period, you can use software to choose freely or use top heater or bottom heater depart, and combine freely with top and bottom heater's capacity, to make it easies for rework double BGA, CCGA, QFN, CSP, LGA, SMD etc. External sensor socket is precise detected temperature to analyze and proof on actual temperature curve of BGA at the same time.

2.Precise optical alignment system
with optical alignment system and clear images, components can enlarge up to Maximum 230 times, mounting accuracy within0.01mm, with a beam split, zoom in, zoom out and micro-adjust functions, adopted 12inch HD monitor.
High-definition CCD color optical vision system, splitting, amplification, micro-adjust and auto focus, with automatic color resolution and brightness adjustment device.

3.Multi-function operation system
Touch screen interface shows current running temperature curves, what can be analyzed, saved.The temperature can be set to 6 segments and 6 segments constant temperature control, N groups of storage temperature setting parameters according to kinds of BGA chip set. With automatic soldering and desoldering functions

4.Precise temperature control system
K-type thermocouple, close-loop control, and intelligent temperature compensation with automatically system,Temperature accuracy is within 1 degree.
Top hot airheater andmounting head is integrated design (2 functions all in). 

5.Superior safety functions
After finish desoldering and soldering, there is alarming, when temperature goes out of control, the circuit will automatically power off, it is of double excess temperature protection function. Temperature parameter has a password to avoid arbitrary changes, with superior safe protection functions, can protect PCB, components and the machine from damage at any abnormal situation.

The technology parameters

1	Total power	Max5300W
2	Top hot air heater power	1200W   (1st heater)
3	Bottom hot air heater power	1200W  (2nd heater)
4	3rd IR heater	2700W
5	power	AC 220V±10    50/60Hz
6	Electrical materials	temperature control systemAdoptedDalianUniversityof Technology
7	Dimensions	L640*W630*H900mm
8	Temperature control	K-type thermocouple (Closed Loop), intelligent temperature compensation system
9	Positioning	V type groove, with universal fixture
9	P C B size	Max 410×370mm, Min65×65mm
10	Available BGA chip	2×2~ 80×80mm(min 0.04*0.04 inch)
11	External temperature sensor	1piece
12	Net weight	65kg
13	Package	Wooden box
14	G.W.	120KG
15	MachineDimension	L75cm*W75cm*H90cm
16	Wooden box dimension	L78*W76*H104cm