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Model Number: ZM-R5860C
Brand Name: Seamark ZM
Place of Origin: China (Mainland)
function: bga chip repair
full description: bga rework station bga chip repair machine for motherboards
warranty: free warranty in the first year
delivery place: Shenzhen, China
shipping: by air, by sea, truck, by dhl
machine heating mode: hot air and infrared both

Specifications

 


Zhuomao ZM-R5860C bga chip repair machine for motherboards

Specifications and technical parameters:

1

Total Power

4800W

2

Top heater

800W

3

Bottom heater

2nd heater 1200W, 3rd IR heater 2700W

4

Power supply

AC220V±10     50/60Hz

5

dimension

635*600*560mm

6

Positioning

V-groove, PCB support , external universal fixture

7

Temp. control

(K Sensor) closed loop, independent heating, precision within 3°C;

8

PCB size

Max 410*370mm    Min 20*20 mm

9

Electrical

selection

temperature control moduleTouch screen

+ PLC

10

Weight

45kg

11

Camera

DC12V PAL   Resolution: 768(H)*494(V)

Features:

1. Touch-screen + PLC control to show 3 temperature graphs, temperature precision within 2 degree.

2. Seven temperature sections: preheating, insulation, heating, welding 1, welding 2, cooling and refrigeration.

3. Save 1 to 50 groups parameters.

4. Top / bottom nozzle are hot air heating. The bottom plates are infrared to preheat the PCB, insure it not deformed.

5. K-Sensor with closed-loop to detect up/down temperature. 

6. alarming when finish welding. Machine with over-heating protection.

7. Cross-flow fan to cool PCB after welding.

8. V-groove& fixtures for regular and irregular PCB boards positioning.

9. for large thermal capacity of PCB/CSP and high-temperature lead-free requirement.

10. The Camera to observe the solder balls reflow from the side when welding, video shown on split 15" LCD.