| Surface Finishing: | immersion tin |
|---|---|
| Min. Line Spacing: | 5mil |
| Min. Line Width: | 5mil |
| Min. Hole Size: | 0.2mm-6.3mm |
| Board Thickness: | Mechanical drill: 8mil(0.2mm |
| Copper Thickness: | Inner 1/2 oz-4oz;Outer 1oz-5oz |
| Base Material: | F4B pcb |
| Model Number: | 4-Layer |
| Brand Name: | XCE |
| Place of Origin: | China (Mainland) |
| color: | green |
| Certificate: | ISO9001:2000 ;ISO14000;CCC;ROHS;FCC;UL |
Quick Details
Specifications
| XCE PCB technical specifications | ||
| Annual stock Material | Rogers,Taconic,Arton,Isola,F4B,-4,High TG,Halogen free | |
| Layer No. | 1~16 | |
| Min board thickness |
2 layer0.2mm 4 layer0.4mm 6 layer 0.6mm 8 layer 0.8mm 10 layer 1.0mm |
|
| Max panel size | 508*610mm | |
| Board thickness tolerance | T≥0.8mm±8%.,T<0.8mm±5% | |
| Wall hole copper thickness | >0.025mm(1mil) | |
| Finished hole | 0.2mm-6.3mm | |
| Min line width | 4mil/4mil(0.1/0.1mm) | |
| Min bonding pad space | 0.1mm(4mil) | |
| PTH aperture tolerance | ±0.075mm(3mil) | |
| NPTH aperture tolerance | ±0.05mm(2mil) | |
| Hole site deviation | ±0.05mm(2mil) | |
| Profile tolerance | ±0.10mm(4mil) | |
| Board bend&warp | ≤0.7% | |
| Insulation resistance | >1012Ωnormal | |
| Through-hole resistance | <300Ωnormal | |
| Electric strength | >1.3kv/mm | |
| Current breakdown | 10A | |
| Peel strength | 1.4N/mm | |
| Soldmask regidity | >6H | |
| Thermal stress | 288℃20Sec | |
| Testing voltage | 50-300V | |
| Min buried blind via | 0.2mm(8mil) | |
| Outer copper thickness | 1oz-5oz | |
| Inner cooper thickness | 1/2 oz-4oz | |
| Aspect ratio | 8:1 | |
| SMT min green oil width | 0.08mm | |
| Min green oil open window | 0.05mm | |
| Insulation layer thickless | 0.075mm-5mm | |
| Taphole aperture | 0.2mm-0.6mm | |
| Special technology | Indepedance,Blind buried via,thick gold,aluminum PCB | |
| Surface finish | HASL,Lead free HASL,Immersion Gold, Immersion Tin, Immersion Silver,OSP ,ENIG ,Golden finger,Blue glue,Gold plating | |