Sputtering target materials for magnetron sputtering deposition, sputtering deposition is a new kind of physical vapor deposition (PVD) method.
In the sputtering target pole (cathode) between the anode and an orthogonal magnetic and electric fields, in the high vacuum chamber by filling the need of inert gas (usually the Ar gas), under the action of electric field, Ar gas ionization into positive ions and electrons, target and has certain negative pressure, from the target from the pole by the effect of magnetic field and the working gas ionization probability increase, form a high density plasma near the cathode, Ar ion under the action of lorentz force, speed up to fly to the target surface, bombarding target surface at a high speed, the target is follow the principle of momentum transfer atoms sputtering out by higher kinetic energy from the target surface to substrate deposition film.
Sputtering coating is mainly used in: flat-panel displays, coated glass industry (mainly including architectural glass, automotive glass, optical thin film glass, etc.), thin film solar, surface engineering & tools (decoration), magnetic, optical recording medium, micrc.oelectronics, automobile lamp, decorative coating, et
Can according to the requirement of the user to provide the following size of molybdenum sputtering target materials:
Plate material: single weight: 200 kg/PC, or less purity: 99.95% or higher