Product Main

Specifications

Major Applications:

l  IC chips, silicon wafer, crystal plates, etc 

l  Polishing treatment of automobile camshaft, crankshaft, steel cylinder, cylinder liner, etc. 

l  Processing of optical device, gemstone, jadeware, glass, cemented carbide, hard and brittle non-ferrous materials, etc. 

l  sapphire processing, semiconductor processing (monocrystalline silicon and polycrystalline silicon) , optical glass, resin bond diamond tools , vitrified bond diamond tools, metal bond diamond tools, lapping compound, polishing paste

l   good alternatives forthe use of silicon carbide and diamond micro powder in ceramics, granite, and marble.