1. Apply to eMCP and eMMC of Sumsung, Sandisk, Toshiba, Hynix, Micron, MTK and Intel.
2. Apply to BGA153 BGA169 BGA162 BGA186 BGA221.(just need to change the coupled socket)
3. Easy operation by just inserting the USB into PC.
4. This product is suitable for eMCP and eMMC size of 11.5x13mm, we also provide another size of 12x16mm,12x18mm,14x18mm.Only one frame guide for each socket default, please tell us you wanted size. If need more, you should pay another $10 for per standard size plate.
5. Apply to eMCP/eMMC thickness of 0.8 to 1.5mm
6. BGA162/BGA186 socket With 17 pins and pin pitch 0.5mm.
BGA221 socket With 36 pins and pin pitch 0.5mm.
BGA153/BGA169 socket With 30 pins and pin pitch 0.5mm.
7. Life cycle is around 25000 times.
8. eMCP/eMMC data can be read and re-written easily.
9. Support flat bottom and solder ball testing.
2. Apply to BGA153 BGA169 BGA162 BGA186 BGA221.(just need to change the coupled socket)
3. Easy operation by just inserting the USB into PC.
4. This product is suitable for eMCP and eMMC size of 11.5x13mm, we also provide another size of 12x16mm,12x18mm,14x18mm.Only one frame guide for each socket default, please tell us you wanted size. If need more, you should pay another $10 for per standard size plate.
5. Apply to eMCP/eMMC thickness of 0.8 to 1.5mm
6. BGA162/BGA186 socket With 17 pins and pin pitch 0.5mm.
BGA221 socket With 36 pins and pin pitch 0.5mm.
BGA153/BGA169 socket With 30 pins and pin pitch 0.5mm.
7. Life cycle is around 25000 times.
8. eMCP/eMMC data can be read and re-written easily.
9. Support flat bottom and solder ball testing.