Feature:
1. Model : eMCP221 ball , Pin Pitch 0.5mm
2. Boundary dimension : 25mm*25mm*4mm
3. Gap Height : 2mm ( To avoid integrated circuit surrounding components and parts )
4. Application : Apply to Sandisk , Sumsung etc eMMC particle
Material & Character :
PCBA plate : FR4 , gold plating bonding pad 30mil , strong electrical conductivity and inoxidizability .
We're the original manufaturer , we can provide the lowest and competitive price , the shortest processing time is guaranteed , if you have any quotos or inquiry ,please contact us freely ! ! !
1. Model : eMCP221 ball , Pin Pitch 0.5mm
2. Boundary dimension : 25mm*25mm*4mm
3. Gap Height : 2mm ( To avoid integrated circuit surrounding components and parts )
4. Application : Apply to Sandisk , Sumsung etc eMMC particle
Material & Character :
PCBA plate : FR4 , gold plating bonding pad 30mil , strong electrical conductivity and inoxidizability .
We're the original manufaturer , we can provide the lowest and competitive price , the shortest processing time is guaranteed , if you have any quotos or inquiry ,please contact us freely ! ! !