Features:
0.aluminium alloy socket with Pogo Pin.
1. Apply to Samsung,Sandisk,Toshiba,Hynix,Micron,MTK,Intel, etc--eMCP
2. Apply to BGA221.
3. Accurate positioning on flat bottom pad and solder of eMCP.
4. Long operating life,up to 30,000 times.
5. Apply to eMCP thickness:0.8--1.5mm.
6. Could reading and writing the data of eMCP with it.
7. eMCP size : 11.5X13mm,pitch:0.5mm.
8. Easy to operate,insert with the SD card reader into your PC, then could read.
9. Support flat bottom and solder ball testing.
 
  
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