| Type: | Other Heat Insulation Materials |
|---|---|
| Model Number: | MP1000 |
| Brand Name: | MP |
| Place of Origin: | China (Mainland) |
| Thermal Conductivity: | 0.022W/mk(200 degree C) |
| Max. application temperature: | 1000 degree C |
| Density: | 200 - 400 kg/m3 |
| Composition: | SiO2 (30-80%)SiC (5-40%); Others (5-10%) |
| Standard Size: | 1000*500mm 600*500mm |
| Thickness Range: | 5-50mm |
| Tolerance: | +-3mm on dimensions; +-1mm on thickness |
Quick Details
Specifications
This material is made of numerous 30-6nm gas holes, which can be up to 3-4 times more thermally efficient than conventional insulation in high temperature applications and suitable for the temperature from -70°C---1100°C.
The board is inorganic material consisting mainly of fumed silica. The other components are opacifiers for minimizing infrared radiation, and silica filaments for improving strength
MP boards are suitable for various environments where heat storage is needed and widely used in iron and steel industry, non-ferrous metal, kilns, electric appliances, instruments and meters (black box), aerospace, transportation, building structures, security equipments and etc.
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Performance: |
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Thermal Conductivity |
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(YB/T4130-2005) |
0.022W/mK @200 degree C |
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0.026W/mK @400 degree C |
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0.029W/mK @600 degree C |
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0.035W/mK @800 degree C |
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Compressive modulus |
3Mpa @ 240kg/m3 |
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Linear Shrinkage |
<2% (1000degree C 24h at one side) |