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Physical Vapor Deposition (PVD): an Environmentally friendly method of deposition of thin films, coating a Substrate with a vaporized form of desired material.

Magnetron Sputtering: Atoms or ions are electrically ejected from a target and transferred to a substrate within a vacuum chamber

Machine Structure:

Advantages of this machine(vacuum PVD coater):
1) Simple visual Interface for the operator, process control system runs on Windows system Interface and easy to use
2) Vacuum pump System efficiency,  which increases productivity due to shorter batch Times
3) High Performance layer monitoring system is equipped for enhanced production result
4) Automated work Cycle, which requires less workers per shift and training time, low production Cost
5) Repeatable and reliable coating
6) Safter and Environmentally-friendly process guarantee
7) Highest Yield

Maximum Loading size:	We design the Vacuum chamber size and loading fixture according to customer requirements
Vacuum chamber type:	Vertical
Vacuum chamber material:	Stainless Steel or carbon steel
Applicable substrate material:	Glass, Plastic, metal, etc.
PVD technology:	DC Magnetron sputtering or unbalanced sputtering
Extraction speed:	8min can Reach 0.05Pa
Vacuum system:	Turbo molecular pump or diffusion pump + Roots pump + mechanical pump
Processing cycle:	It Takes less than 15 minutes to complete the process from substrate placement, Sputtering, and removal. It also varies according to different processes.
Reflectivity:	85% or more
Sputtering chamber:	High Utilization sputtering cathode
Sputtering power type:	DC or unbalanced sputtering power
Sputtering materials:	Aluminum, copper, titanium, stainless steel, silver, etc. According to Customer process requirements
Process gas:	Argon, nitrogen, oxygen, acetylene, etc

Applications: